On products compatible with EU RoHS Directive
Our company has materialized products compatible with EU RoHS Directive by employing a lead-free solder for the external terminals and a bromine-based flame retarding material, other than PBB/PBDE, for the sealing resin. It should be noted, however, that the solder used for jointing chip on leadframe contains lead in high-melting-point solder (lead-based alloy containing above 85% of lead by weight) which is exempted item with EU RoHS Directive.
On package types
For each of the following package types, the method of securing compatibility with EU RoHS Directive is explained.
- Power MOSFET, Automotive MOSFET
- Various Types of Diodes
- IGBT Molds
For any questions, please ask "From Here."
